Lol someone should make a water cooled system for the VESC 
If the Vesc Enclosure itself was the Heatsink, then it would be directly exposed to the wind for superior cooling, …seperate from the battery enclosure.
thought about it, but you don’t want liquid in your board, waiting to be spilled.
i think we will need it if we start racing eboards competitively. I have had some excellent results cooling 18650’s with embedded cooling line. It wasn’t pretty but it worked really well. The challenge is fitting everything inside a deck. 
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Can’t we build a Heat Sink “Evolve style” , which is exposed to the wind ??
Just having Wind cooling the Fins,… seems to me would make a big difference?
Chaka didn’t mean to step on your heatsink progress with the over-the-top title. I thought it might lure more people. When u say u don’t want to heatsink the bottom of the fets because of the large positive terminal are u afraid people would short the board? I’m looking to get the most cooling possible as I’ll be running one hub motor and anticipate a lot of amps and heat
Yea having one giant exposed positive terminal is never a good idea. Super easy to short. When I rode with you last time it didn’t seem that your VESC got that hot. Given, you were on a dual setup, but I don’t imagine it’ll get that much hotter on a single especially running 12s. I have some raspberry pi heatsinks you can throw on the mosfets if you want. Since you don’t run an enclosure the wind hitting the sinks directly should help control temperatures pretty well.
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On the original post, @Hummie mentioned the IRFP7530 MOSFET which happens to be the exact MOSFET im using in my EBoard Switch and doing the math the 7530 wouldn’t need a heatsink at 30A continuous in a 63°C environment at its max RDSON which is usually around 1.65Miliohms not 2 which is what I based the calculations off of. Anyways the 7530 would be a great substitute for the VESC fets if it ever becomes necessary to increase the max VESC amperage. Also people where worried about heatsinks possibly shorting out things because they would be live connections, but you could just use non conductive thermal past to fix that problem, thats what most people do for adding heatsinks to fets because the flange is usually a drain as well. IRFP7530PbF Datasheet
*EDIT: just realized that the MOSFET’s used on the VESC currently are 7530 versions though there actually better, or at least have a lower RDSON of only 1.4mOhms and a C/W of 40. So yeah pretty much disregard what I said about the 7530 as a replacement for the current fets. Though the 7530 is still a great mosfet for other applications.
I guess he doesn’t work for the motherboard companies that have been doing this now for about 15+ years with all the added research they’ve done in the field?
Hey bud you can get non-conductive thermal compound to separate the heatsink from the conductive material.
Edit: Something like this: http://www.ebay.com.au/itm/like/182063660930?lpid=107&chn=ps
Yes this isn’t a Vesc, but I think it does support the notion that heatsinks can be beneficial.
I know you cant read much into this because there is nothing to suggest they are the same esc but I can only conclude the HV160 and HV160 lite are identical besides cases and heatsinks. Hv160 requires 5mph airflow for rating, Hv160 lite 20mph airflow for its rating.
http://www.castlecreations.com/products/phoenix-ice2-hv.html